Alloy Name | |
UNS | C-11000 |
DIN CEN/TS 13388 | CW004A |
EN | E-Cu,E-Cu58 |
JIS | E-Cu,E-Cu58 |
JIS | C-1100 |
We are producing ETP Grade high Electrical Conductivity Copper Foils, Strips and Sheets with Thickness Range from 0.04mm to 2.5mm & Maximum Width of 400mm in all range of Tempers/ hardness with reduced burr height of below 15 microns.
Cu-ETP is an oxygen containing copper which has a very high electrical and thermal conductivity. It has excellent forming properties and AMWL-11 Grade is weldable which is very suitable for Foil Wound Transformers.
Chemical Composition | Weight percentage |
Cu | 99.90 min % |
O | 0.005...0.040 % |
Main Applications |
Electrical : Foil Wound Transformers, Switches, Elect. Terminals, Contacts, Flexible Busbars, XLPE Cable Wrap/Shielding Tapes etc. |
Industrial : Stamped/Punched parts, Chlorine Battery Caps, Heat sinks etc. |
Physical Properties Typical values in annealed temper at 20 °C | ||
Density | 8.93 | g/cm3 |
Thermal expansion coefficient -191 .. 16 | 14.1 | 10-6/K |
Specific heat capacity - 0 .. 300°C | 17.7 | 10-6/K |
Thermal conductivity | 0.386 | J/(g•K) |
Electrical conductivity (1 MS/m = 1 m/(O mm²) | 394 | W/(m•K) |
Electrical conductivity (IACS) | 58 | MS/m % |
Thermal coefficient of electrical resistance (0 .. 200 C) | 100 | 10-3/K |
Modulus of elasticity ( 1 GPa = 1 kN/mm²) cold formed | 130 | GPA |
Mechanical Properties (EN 1652) | ||||
Temper | Tensile Strength Rm MPa (N/mm2) |
Yield Strength Rp0.2 MPa (N/mm2) |
Elongation A50mm % | Hardness HV |
O (SOFT) | 210 min | 70 | 35 Min | 65 Max |
HB (half Hard) | 240 min | 180 | 10 Min | 70 to 95 |
HD (Hard) | 290 min | 250 | 90 min |
Fabrication Properties | |
Capacity for being Hot and Cold worked Gas Shield Arc Welding Machinability | Excellent Very Good |
Capacity for being Hot-Dip Tinned | 20% of Free Cutting Brass |
KEI usually maintains a surface roughness in range of 0.15 to 0.25 on Ra scale for Better Electroplating Properties. | Excellent |